Lead-free soldering tin features

? Good printing rolling performance and leak printing performance, even the spacing of solder pad is low to 0.4mm, can also complete a exquisite printing.
? Can complete continuous printing for a long time, almost without collapse after printing for a few hours, small viscosity change, SMD components are not easy to move.
? Excellent soldering performance, can complete a good wetting in different parts.
? Less residue after soldering、transparent appearance, high insulation resistance, donot corrode the PCB ,and meet the disposable requirement.
? Better ICT test performance, will not appear the false judgment.

Semiconductor high temperature high lead content solder paste

Semiconductor high temperature high lead content solder paste is specially produced for grain adhesion process. This product is carefully formulated, adopt the automatic
glue dispensing equipment to provide a stable volume of solder paste, has a reliable performance. Semiconductor high temperature high lead content solder paste is used
for reflow in nitrogen environment, leave a completely harmless residue, he residue accounts for 2% of solder paste.
1.Specially for the power semiconductor encapsulation soldering use ,wide operating window.
2.Adopt SnPb92.5Ag2.5 Tin powder, Pb content more than 85% in soldering material,which belongs to a exempted soldering material in RoHs instruction.
3.Stable chemistry performance, can meet the long time dispensing glue and printing requirements.
4.Has a good smoothness and stability of automatic dispensing glue, gum exudation and viscosity change little. excellent film removal ability when soldering, be suitable for 0.2-0.4mm mounting of crystallite size printing.
5.Good soldering ability, and has a high online qualified rate, the rate of soldering point appear pore is below 10%.
6.Good storage performance of product, can be stored for a week at 25℃,the shelf life at a temperature between 0℃ and 10℃ is 6 months.
7.Appropriate heating methods: reflow oven、tunnel stove、constant heat oven.

Granule distributing of tin powder

Performance parameter

Advise a reflow soldering profile

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